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PLASMA SPUTTER SYSTEMS TETRA 8[ PLASMA CLEANER - PLASMA ETCHER - PLASMA ASHER - PLASMA ACTIVATION ]The TETRA 8 plasma cleaner is configured with a sputtering system for high-vacuum-based coating technology and for cleaning processes in preparation of highly pure surfaces. Give us a call! We´d be happy to discuss more details. Tel.: +49 (0) 7458 - 999 31 - 0 Basic configuration - Body: W 610 mm x H 1,700 mm x D 800 mm- Chamber volume: about 8 liters - Power supply: 400 V / AC 3 phases, 16 A Gas supply - 3 pcs. Mass-Flow-Controller (MFCs)Vacuum chambers - Stainless steelrectangular with hinged door (approx. W 160 mm x H 160 mm x D 325 mm) Sputtering - 1 sputtertable 2 "- 3 " + shutter(gas mantle and inlet for reactive processes is optional) Substrate holder - Ø 140 mm (optional rotatable substrate heater, substrate cooling)- Switchable as an electrode for plasma pre-treatment (cleaning, Activating, etching) Control - PC-Control (Microsoft Windows XPE)Pressure measurement - Baratron (for use with corrosive gases)Generator Frequencies: 40 kHz: Power 0 - 500W13.56 MHz: Power 0 - 300 W Bias-voltage source DC or pulsed unipolar Power max. 300 W Voltage max. 600 V DC All generators are continuously adjustable from 0 - 100% Vacuum pump - in different sizes from different manufacturers(With active carbon filter if required) - Turbo pump More options Spare parts sets, corrosive gas version, gasbottle, pressure reducer, heating plate, temperature indicator, heatable chamber, faraday box, polymerization equipment , test ink set, oxygen-generator, slow ventilation of the vacuum chamber, slow pump down of the vacuum chamber, TEM sample holder flange, maintenance / service, documentation in national language, installation on site.Here is our TETRA 8 |
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